With some exceptions, these tin-lead solders can be used to join copper and most copper alloys, lead, nickel alloys and steel. Tin-lead solders are not recommended for joints subject to high stress or vibration in the cooling industry due to lack of sufficient elongation properties. These solders are also available with rosin or acid core.
Harris® Lead-Bearing Solder, 50/50 Series, 1 lb Net Content, Spool Container, Composition: 50% Tin, 50% Lead, 1/8 in Wire Diameter, 420 deg F Melting Point, Lead/Tin
Alloy Type | : | Solder |
Chemical Composition | : | Tin 49.5-51.5%;Lead Remainder% |
Color | : | Gray/Silver metallic |
Composition | : | 50% Tin, 50% Lead |
Container Type | : | Spool |
Diameter | : | 1/8" (3.18mm) |
Liquidus | : | 421 deg F (216 deg C) |
Material | : | Lead/Tin |
Melting Point | : | 420 deg F |
ModelName | : | 50/50 Solder |
Net Content | : | 1 lb |
Recommended Flux | : | Stay-Clean liquid or paste soldering flux is recommended for most base metals. Stay-Clean is not recommended for electrical or electronic applications. |
Series | : | 50/50 Series |
Size | : | 1 lb. spool |
Solidus | : | 361 deg F (183 deg C) |
Wire Diameter | : | 1/8 in |
Harris® 505061