LucasMilhaupt® HANDYFLO-STICK HANDYFLO-STICK

LucasMilhaupt® Handy-Flo® HANDYFLO-STICK Solder Stick, 1325 deg F Melting

  • Item ID: HANDYFLO-STICK
  • Min. Order Qty: 1
  • Item ID: HANDYFLO-STICK
  • Brand: LucasMilhaupt®
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Handy-Flo® 6 is a silver-copper-phosphorus alloy used for brazing copper to copper or copper to copper alloys, most often in the HVAC industry. It should not be used on ferrous or nickel base materials due to the brittle intermetallic that forms. The phosphorus in the Handy-Flo® 6 serves as a fluxing agent, so the alloy does not require flux for copper to copper joints. Flux is recommended for copper to brass joints.

LucasMilhaupt® Solder Stick, Composition: Copper, Silver, Phosphorus, Solid Form, 1325 deg F Melting Temperature, Light Copper, Cut Materials: Copper, Non-Ferrous Copper Base Alloy

  • Joins CU to CU (phosphorus serves as flux)
  • Joins CU to brass (flux is recommended)
  • Melts and flows at temperatures very close to 15% Ag
  • Slow flow
  • Made in USA
Color      :      Light Copper
Composition      :      Copper, Silver, Phosphorus
Cut Materials      :      Copper, Non-Ferrous Copper Base Alloy
Form      :      Solid
Melting Temperature      :      1325 deg F
  • SDS https://assets.unilogcorp.com/267/ITEM/DOC/LucasMilhaupt_HANDYFLOSTICK_SDS.pdf
  • Specification Sheet https://assets.unilogcorp.com/267/ITEM/DOC/LucasMilhaupt_HANDYFLOSTICK_Specification_Sheet.pdf
  • SDS https://assets.unilogcorp.com/267/ITEM/DOC/LucasMilhaupt_HANDYFLOSTICK_SDS.pdf
  • Specification Sheet https://assets.unilogcorp.com/267/ITEM/DOC/LucasMilhaupt_HANDYFLOSTICK_Specification_Sheet.pdf

LucasMilhaupt® HANDYFLO-STICK